Bonding Technology

Mounting Semiconductors on the Substrate

We use various technologies to connect unhoused semiconductors to the substrate: electrically conductive and/or heat-conducting gluing or soldering. For power semiconductors we recommend different vacuum soldering processes or sintering. The top sides of the chips are electrically connected with gold or aluminum wires in various diameters. In special application areas platinum wire can be used. Depending on the wire, a wedge-wedge or ball-wedge bonding process is used. Depending on their purpose, unhoused semiconductors are encased with different coatings or the semiconductor is completely embedded with the circuit. In the sensor technology field, we can employ selective/partial and/or high-limited or shaped casings for semiconductors.