Because Mounting Matters
We can mount SMD components on all substrates. All conventional types of housings, plus 0201, fine pitch, CSP, BGA elements, etc. can be processed. We also mount wired components and connection pins. Mounting unhoused semiconductors is possible either in combination with SMD components or “pure.” We are able to process all types of semiconductors, such as sensors, ASIC, logic and power semiconductors. If necessary for miniaturization or to extend service life, we also mount components directly on the substrate as flip-chip components, chip-on-board, or even as chip-on-chip.